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Electronic radiator introduced species and how to choose Aluminum Heatsink
Radiator types is no strict definition, there is no strict classification. Processing method in accordance with generally radiator, cooling method, professional use, the use of materials, the use of power, radiators and other characteristics of classification.

(1) divided by processing methods. There are inserted finger radiator (sheet metal forming), profiles radiator (extruded profiles), insert radiator, cast radiator.

(2) divided by the cooling method. Natural cooling radiators, air-cooled radiators, radiator liquid cooling (water cooler, oil cooling radiators), cold radiators, heat pipe radiator.

(3) by professional zoning. There are power device radiator, radiator module integrated radiator, radiator resistance, frequency radiator, chassis, motor casing integrated radiators, radiator welding, power radiators, radiator cards, IT radiator .

(4) by the use of material points. Aluminum radiator, copper radiator, steel radiator.

(5) by use of power points. There are low-power radiators, radiator power, high power radiators.

(6) divided by the characteristics of the radiator. There are bamboo West radiator (intermediate plus two high fin fins short, tall, short ribs have small teeth, large cooling area, high mold costs), fine-toothed profile radiator (dense teeth, tooth height, cooling area , mold processing difficult, high-cost molds for high-power air-cooled), the combination radiator (radiator consists of two parts or two or more parts by mechanical or special processing methods constituted as a combination of radiators and other profiles ).
How to buy electronic radiator
The last traded price of the radiator and radiator selected specifications, quantities, delivery, payment methods, there is little need to pay particular attention to users generally use aluminum or aluminum radiator 6063 to make these two materials have good thermal conductivity compared with miscellaneous poor thermal conductivity of aluminum is several times; (coefficient of thermal conductivity data [see]) due to the cost of more than half of the heat sink material costs, the price of miscellaneous aluminum is low; therefore, particularly inexpensive radiators, to consider the loss of thermal performance of the material caused by the time of purchase.
First, to determine the cooling of electronic components, specifically its operating parameters, working conditions, size, installation, select the size of the radiator plate slightly larger than the component mounting surface can, because of restrictions on the installation space, rely mainly on the radiator and the air convection cooling, beyond contact with the component side of the radiator, its cooling effect and increases with decreasing distance from the component. For single-ribbed radiator, radiator width if required in the table vacant, choose two or three times the width of the radiator can be truncated.
Method for calculating the heat sink selection
Cooling formula:
Rtf = (Tj-Ta) / Pc - Rtj -Rtc
Rff heat sink thermal radiator is the main basis for selection. Tj and Rtj parameters of semiconductor devices are provided, Pc is a parameter design requirements, Rtc look-up table from the thermal design professional books.
(1) Calculate the total thermal resistance Rt: Rt = (Tjmax-Ta) / Pc
(2) calculation of the temperature rise or sink thermal resistance Rtf ΔTfa: Rtf = Rt-Rtj-Rtc ΔTfa = Rtf × Pc
(3) determine the radiator: radiator according to the working conditions (natural cooling or forced air cooling), select the radiator according to Rtf or ΔTfa and Pc, check the selected radiator cooling curve (curve or ΔTfa Rtf line), on the curve when detected value is less than the calculated value, to find the right radiator.
For profiles radiator, when the thermal resistance curve can not be found or when the temperature rise curve can be determined by the following method:
According to the above formula calculated radiator temperature ΔTfa, and then calculate the radiator integrated heat transfer coefficient α:
α = 7.2ψ1ψ2ψ3 {√√ [(Tf-Ta) / 20]}
Description ψ1─── radiator L / b α affected, (L is the length of the radiator, b is the distance between two ribs sheet);
ψ2─── α describing the impact of the radiator h / b Dui, (h is the height of the heat sink fins);
ψ3─── description on α when the radiator width dimension W increases;
√√ [(Tf-Ta) / 20] ─── maximum surface temperature of the heat sink describe the impact on the surrounding environment of the temperature rise of α;
The above parameters can look-up table.
Calculation sheet surface between the flanks of the bulk power q0
q0 = α × ΔTfa × (2h + b) × L
Number ribbed heat sink fins according to single-sided or double-sided ribbed n, calculate power dissipation Pc '
Sided fins: Pc '= nq0
Sided fins: Pc '= 2nq0
If Pc '> when Pc is able to meet the requirements.
Parameter definitions:
Rt─── total resistance, ℃ / W;
Within Rtj─── semiconductor device thermal resistance, ℃ / W;
Rtc─── interfacial thermal resistance of semiconductor devices and the interface between the heat sink, ℃ / W;
Rtf─── sink thermal resistance, ℃ / W;
Tj─── semiconductor device junction temperature, ℃;
Tc─── semiconductor device case temperature, ℃;
Tf─── heat sink temperature, ℃;
Ta─── ambient temperature, ℃;
Pc─── use of power semiconductor devices, W;
ΔTfa ─── radiator temperature, ℃;

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